sales@podpcb.com
+968 556 778 345
| Preferred Materials | |
|---|---|
| FR4 Standard Tg |
Shengyi, ITEO, KB, Nanya |
| FR4 Mid Tg (Lead Free Compatible) |
Shengyi S1000, ITEO IT158 |
| FR4 High Tg (Lead Free Compatible) |
Shengyi S1000-2, S1170 EMC EM827 Isola 370HR ITEO IT180A Panasonic R1755V |
| High Performance Low Loss FRA |
EMC EM828, EM888(S), EM888(K) Isola FR408, FR408HR Isola I-Speed, I-Tera MT Nelco N4000-13EP, EPSI Panasonic R5775 Megtron 6 |
| RF Materials |
Rogers RO4350, RO3010 Taconic RF-30, RF-35, TLC, TLX, TLY Taconic 601, 602, 603, 605 |
| Halogen Free |
EMC EM285, EM370(D) Panasonic R1566 |
| Aluminum Backed PCB | Shengyi SAR20, Yugu YGA |
| Additional Materials | |
|---|---|
| Rigid Polyimide | Shengyi SH260, Ventec VT901 |
| BT Epoxy | Nelco and Mitsubishi |
| High CTI FR4 | Shengyi S1600 |
| Flexible Circuit Materials | Dupont, Panasonic, Taffex, Shengyi |
| PCB Technologies | Standard | Advanced |
|---|---|---|
| Rigid-Flex & Flexible Circuits | Y | Y |
| Buried and Blind Vias | Y | Y |
| Sequential Lamination | Y | Y |
| Impedance Control | ±10% | ±5% |
| Hybrids & Mixed Dielectrics | Y | Y |
| Aluminum PCB's | Y | Y |
| Non-Conductive Via Fill (VIP) | Y | Y |
| Conductive Via Fill | Y | Y |
| Cavity Boards | Y | Y |
| Backdrilling | Y | Y |
| Controlled Depth Drill and Rout | Y | Y |
| Edge Plating | Y | Y |
| Buried Capacitance | Y | Y |
| Etch Back | Y | Y |
| In-board Beveling | Y | Y |
| 2-D Bar Code Printing | Y | Y |
| Standard Features | Standard | Advanced |
|---|---|---|
| Maximum Layer Count | 20 | 36 |
| Maximum Panel Size | 533x610mm [21x24"] | 610x1067mm [24x42"] |
| Outer Layer Trace/Spacing (1/3oz starting foil + platig) |
90μm/90μm [0.0035"/0.0035"] | 64μm/76μm [0.0025"/0.003"] |
| Inner Layer Trace/Spacing (Hoz inner layer cu) |
76μm/76μm [0.003"/0.003"] | 50μm/50μm [0.002"/0.002"] |
| Maximum PCB Thickness | 3.2mm [0.125"] | 6.5mm [0.256"] |
| Minimum PCB Thickness | 0.20mm [0.008"] | 0.10mm [0.004"] |
| Minimum Mechanical Drill Size | 0.20mm [0.008"] | 0.10mm [0.004"] |
| Minimum Laser Drill Size | 0.10mm [0.004"] | 0.08mm [0.003"] |
| Maximum PCB Aspect Ratio | 10:1 | 25:1 |
| Maximum Copper Weight | 5 oz [178μm] | 6 oz [214μm] |
| Minimum Copper Weight | 1/3 oz [12μm] | 1/4 oz [9μm] |
| Minimum Core Thickness | 50μm [0.002"] | 38μm [0.0015"] |
| Minimum Dielectric Thickness | 64μm [0.0025"] | 38μm [0.0015"] |
| Minimum Pad Size Over Drill | 0.46mm [0.018"] | 0.4mm [0.016"] |
| Solder Mask Registration | ±50μm [0.002"] | ±38μm [0.0015"] |
| Minimum Solder Mask Dam | 76μm [0.003"] | 64μm [0.0025"] |
| Copper Feature to Edge, V-cut (30°) | 0.40mm [0.016"] | 0.36mm [0.014"] |
| Copper Feature to PCB Edge, Routed | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Tolerance on Overall Dimensions | ±100μm [0.004"] | ±50μm [0.002"] |
| HDI Features | Standard | Advanced |
|---|---|---|
| Minimum Microvia Hole Size | 100μm [0.004"] | 75μm [0.003"] |
| Capture Pad Size | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Glass Reinforced Dielectrics | Y | |
| Maximum Aspect Ratio | 0.7:1 | 1:1 |
| Stacked Microvias | Y | Y |
| Copper Filled Microvias | Y | Y |
| Buried Filled Vias | Y | Y |
| Maximum No. of Building Layers | 3+N+3 | 5+N+5 |
| Advanced Processes |
|---|
| Direct Imaging for Innerlayers, Outerlayers, and Soldermask |
| Direct Plating for High Layer Count and Microvias Products |
| Reverse Pulse Plating |
| Solid Copper Plated PTH Vias |
| XACT Tooling System for Improved Layer-to-Layer Registration |
| Spray Coating for Soldermask |
| Inkjet Printing for Legend |
| In-Line AOI for Outerlayers and AOI for Final Inspection |
| ORMET® Copper Paste for Any-layer Connections |
| ZETA® Material for HDI and Low-Loss Applications |
| Quality System and Certifications |
|---|
| IPC Specs: IPC-A-600, IPC-6012, IPC-6013, IPC-6016 (Class II and Class III) |
| Quality System Certifications: ISO 9001:2008, TS16949:2009, ISO13485:2003 |
| Environmental Certifications: ISO14001:2004, ISO/TS14067:2013 |