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4 Layer High Frequency PCB Built On RO4350B With Blind Via and Immersion Gold

MOQ: 1
Price: USD2.99-9.99 Per Piece
Standard Packaging: Vacuum
Delivery Period: 10 working days
Payment Method: T/T, Paypal,WestUnion
Supply Capacity: 45000 pieces per month

Product Description

4 Layer High Frequency PCB Built On RO4350B With Blind Via and Immersion Gold

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

General Description

This is a type of 4-layer HDI high frequency PCB circuit board built on RO4350B with RO4450B prepreg for the application of radar RF board. It’s a multilayer layer RF PCB board at 1.0 mm thick with immersion gold finish and solder mask and silkscreen. This board contains blind via from top layer to inner 1, top layer to inner 3. Since it’s asymmetric buildup, 1.2% warpage is allowed. It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.

Features and benefits

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications.

Reducing signal loss in high frequency application meets the development needs of communication technology.

Excellent high frequency performance due to low dielectric tolerance and loss.

Gold has high solderability, no stressing of circuit boards and less contamination of PCB surface.

Engineering design prevents problems from occurring in pre-production.

100% tests inclusive of electrical test and AOI inspection.

Fast and flexible to save the time of production from prototype to standard production

Great customer service

UL recognized and RoHS Directive-compliant

Application

RF module, Power splitter, Low Noise Block, 3G antenna

PCB SIZE98.02 x 101.02 mm =1up
BOARD TYPEHDI PCB, High frequency PCB
Number of Layers4 layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ——- 35um(1 oz)+plate TOP layer
RO4350B 6.6mil
Inner Layer 1, 18um (0.5oz)
Dielectric RO4450B 4mil x2
Inner Layer 2, 18um (0.5oz)
Dielectric RO4350B 20mil
copper ——- 35um(1oz) + plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:5 mil / 4.9 mil
Minimum / Maximum Holes:0.3 mm / 5.5 mm
Number of Different Holes:10
Number of Drill Holes:125
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:RO4350B Tg280℃, er<3.48, Rogers Corp.
Final foil external:1.5 oz
Final foil internal:0.5 oz
Final height of PCB:1.0 mm ±10%
PLATING AND COATING 
Surface FinishImmersion gold, 35%
Solder Mask Apply To:TOP, 12micron Minimum
Solder Mask Color:Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type:LPSM
CONTOUR/CUTTINGCNC Routing
MARKING 
Side of Component LegendTOP
Colour of Component LegendWhite, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated through hole(PTH), minimum size 0.3mm. Blind via L1-L2, L1-L3
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059″
Board plating:0.0029″
Drill tolerance:0.002″
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.
quote

4 Layer High Frequency PCB Built On RO4350B With Blind Via and Immersion Gold