Product Description

3 Layer High Frequency PCB Built On 60mil RO4350B and 6.6mil RO4350B with ENIG for Wireless Booster

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

Hi Everyone,

Multilayer high frequency PCBs are made from all high frequency material inclusive of prepreg adhesive. For example, a 4-layer RO4350B PCB is a compound of 2 cores of RO4350B substrates. As is known to all, there’re 8 cores in RO4350B family, i.e. 4mil (0.101mm) to 60mil (1.524mm).

So it’s very interesting that stack-up of 4 layers can be done in many different ways.

This 3-Layer high frequency PCB is built on 2 cores of RO4350B and one layer of copper is etched off, left 3 layers on.

The structure is one sheet of 60mil RO4350B plus 4mil RO4450F prepreg and combined 6.6mil RO4350B. The board is a square with 110mm x 110mm, with immersion gold finishes on pads. They’re 20 pieces packed for shipment and used for wireless booster.

Following is the actual value in engineering manufacture.

Features and benefits

1) Excellent high frequency performance due to low dielectric tolerance and loss;

2) Reducing signal loss in high frequency application meets the development needs of communication technology;

3) Professional and experienced engineers check your production files

4) Hassle-free, one-to-one after-sales service;

5) UL, ISO14001, IAFT16949 certified factory.

Applications

Amplifier, Antenna combiner, Frequency converter, Trunk amplifier, RF module, Power splitter, Low Noise Block, 4G antenna

Parameter and data sheet